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|New ETS-T40 upgrade version supports latest Intel® LGA 2011 socket. You can find a note about the LGA 2011 readiness on the product packaging. A set of four screw pillars is included. |
|Vortex Generator Flow (VGF) - patented |
Vortex generators are applied in aviation industry. They make sure that the air stream is lead as close as possible along the airplane’s wings. During the CPU cooler development, the Enermax engineers recognized the potential of this technology to optimize the air stream inside the heat sink: Small spoilers on the fins, the so-called Vortex generators, conduct the air close along the heat pipes. Much more fresh air can be transferred to the back of the heat pipes.
|Stack Effect Flow (SEF) - patented |
The Stack Effect is a natural, physical phenomenon: Warm air is rising up because of its lower density and leaves a low pressure behind that in turn pulls cool air. Four openings in the middle of the heat sink make use of this effect. They interrupt the air stream so that the warm air gains space to escape. The heat dissipation can be accelerated.
|Vacuum Effect Flow |
Also the third innovation makes use of a physical effect. The best example to explain this effect is a moving car: It pushes air aside as it goes down the road and leaves a low pressure. Air from the sides will be sucked in to compensate the difference in pressure. According to that, the CPU cooler sides are not fully closed, so that cool air can be sucked into the heat sink.
|Heat Pipe Direct Touch |
Heat Pipe Direct Touch means that the heat pipes rest directly on the CPU. It has the unquestionable advantage against a base plate, that it transfers the heat effectively without any additional resistance straight to the heat pipes.
|Minimal contact area |
For an effective noise reduction
|Rotor with integrated magnet |
For a frictionless and smooth motion
|Self-lubricating bearing sleeve |
Abrasion protection for a longer lifetime
|Twister Bearing Technology (patented)|
|Persistent low noise level|
|Longer life: up to 100.000 hours MTBF|
| Magnetized steel ball |
| Self-lubricating nano bearing |
| Coils |
|Flexible magnets inside the rotor|
|CPU Socket||- Intel® LGA 775/1155/1156/1366/2011*
- AMD® AM2/AM2+/AM3/AM3+/FM1/FM2
|Material||Copper Heat Pipes / Aluminium Fins|
|Fan Speed||800 – 1,800 RPM|
|Fan Airflow||37.57 – 86.70 CFM|
|Fan Dimension||Dual 120 x 120 x 25 mm|
|Dimension (W x D x H)||Heat Sink Dimension: 139(L) x 70(W) x 160(H)mm|