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  • ENERMAX ETS-T40-TB CPU Cooler
  • ENERMAX ETS-T40-TB CPU Cooler
  • ENERMAX ETS-T40-TB CPU Cooler
  • ENERMAX ETS-T40-TB CPU Cooler
  • ENERMAX ETS-T40-TB CPU Cooler
  • ENERMAX ETS-T40-TB CPU Cooler
  • ENERMAX ETS-T40-TB CPU Cooler

ENERMAX ETS-T40-TB CPU Cooler

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Quick Overview

Air CPU Cooler, Intel® LGA 775/1155/1156/1366/2011, AMD® AM2/AM2+/AM3/AM3+/FM1/FM2, 2x 120mm fan, 800 ~ 1800 RPM
Rp560.000

Availability: In stock

( Last updated: 11 Dec 2015 )

Syarat & Ketentuan:
  • Harga dan ketersediaan barang dapat berubah sewaktu - waktu tanpa pemberitahuan
  • Mohon konfirmasi terlebih dahulu sebelum melakukan pemesanan
  • Harga yang tertera untuk produk-produk yang Tidak Ready Stock di toko adalah Harga untuk Wilayah DKI JAKARTA, dan belum termasuk ongkos kirim dari Distributor di JAKARTA melalui jasa ekspedisi

Details

NEW: Intel® LGA 2011 ready!


New ETS-T40 upgrade version supports latest Intel® LGA 2011 socket. You can find a note about the LGA 2011 readiness on the product packaging. A set of four screw pillars is included.

VORTEX GENERATOR FLOW (VGF)


Vortex Generator Flow (VGF) - patented
Vortex generators are applied in aviation industry. They make sure that the air stream is lead as close as possible along the airplane’s wings. During the CPU cooler development, the Enermax engineers recognized the potential of this technology to optimize the air stream inside the heat sink: Small spoilers on the fins, the so-called Vortex generators, conduct the air close along the heat pipes. Much more fresh air can be transferred to the back of the heat pipes.

STACK EFFECT FLOW (SEF)


Stack Effect Flow (SEF) - patented
The Stack Effect is a natural, physical phenomenon: Warm air is rising up because of its lower density and leaves a low pressure behind that in turn pulls cool air. Four openings in the middle of the heat sink make use of this effect. They interrupt the air stream so that the warm air gains space to escape. The heat dissipation can be accelerated.

VACUUM EFFECT FLOW (VEF)


Vacuum Effect Flow
Also the third innovation makes use of a physical effect. The best example to explain this effect is a moving car: It pushes air aside as it goes down the road and leaves a low pressure. Air from the sides will be sucked in to compensate the difference in pressure. According to that, the CPU cooler sides are not fully closed, so that cool air can be sucked into the heat sink.

HEAT PIPE DIRECT TOUCH (HDT)


Heat Pipe Direct Touch
Heat Pipe Direct Touch means that the heat pipes rest directly on the CPU. It has the unquestionable advantage against a base plate, that it transfers the heat effectively without any additional resistance straight to the heat pipes.

TWISTER BEARING TECHNOLOGY

Minimal contact area
For an effective noise reduction

Rotor with integrated magnet
For a frictionless and smooth motion

Self-lubricating bearing sleeve
Abrasion protection for a longer lifetime
Twister Bearing Technology (patented)
Persistent low noise level
Longer life: up to 100.000 hours MTBF
Magnetized steel ball
Self-lubricating nano bearing
Coils
Flexible magnets inside the rotor

Additional Information

Brand ENERMAX
CPU Socket - Intel® LGA 775/1155/1156/1366/2011*
- AMD® AM2/AM2+/AM3/AM3+/FM1/FM2
Material Copper Heat Pipes / Aluminium Fins
Fan Speed 800 – 1,800 RPM
Fan Airflow 37.57 – 86.70 CFM
Fan Noise 10-21dB(A)
Connector 4Pin PWM
Fan Dimension Dual 120 x 120 x 25 mm
Dimension (W x D x H) Heat Sink Dimension: 139(L) x 70(W) x 160(H)mm
Shipping Weight 2.0000
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